For the first time, the conference will be co-located with the 15th International Conference on Condition Monitoring and Machine Failure Prevention Technologies (CM 2018/MFPT 2018), which will allow delegates to customize their experience by visiting both events under one roof.
BINDT has always recognized the importance of encouraging students to participate in this major international event. As a repeat to the gesture in 2017, the 57th Annual British Conference on Non-Destructive Testing will provide generous sponsorship of student registrations in 2018, resulting in a major reduction of fees for student attendance.
There will be three parallel technical sessions covering a broad range of NDT technologies and applications.
For details, visit www.bindt.org/events/NDT-2018/.